Kirin 980 will be HiSilicon’s latest and fastest Chipset: Will Rival Snapdragon 845
Usually, when it comes to new launches, the attention and general excitement is towards upcoming smartphones. But the smartphones are made of essential parts like the processor, battery, camera, screen and many other big and small things. Nevertheless, the processor (or the chipset) remains one of the most critical and valuable parts in a smartphone given that everything revolves around it.
On that note, HiSilicon (Huawei’s subsidiary which produces processors for the company) will be introducing its next-gen flagship processor, Kirin 980, soon. The unveiling will most likely take place in Germany at the IFA event.
For now, it seems that the specs of the upcoming Kirin 980 have been leaked. It will be an octa-core processor at the least and 4 of its 8 cores are clocked at the highest 2.8 GHz. At the same time, the remaining 4 cores are meant to keep the reliability intact. In a basic comparison, the HiSilicon’s current flagship, Kirin 970, clocks at 2.4 GHz.
The HiSilicon Kirin 980 is being developed on the impressive 7 nm FinFet process by TSMC. This means compact size with the emphasis on efficiency related to power management. The standby times should be particularly impressive here.
Also, the Kirin 980 will have native support for AI (Artificial Intelligence) which means that Huawei should be able to implement the same in a more effective manner. Furthermore, it is said that HiSilicon is also working on its in-house GPU which, rumor says, could be 1.5 times faster than the Adreno 630 (found in Snapdragon 845).
It seems HiSilicon is pulling all its might into this one and is intent on going face to face with Qualcomm with much better preparedness than ever.